HSPM is one of Microchip’s eService suite of applications which is used by Assembly subcons to submit Bill of Material information for assembly packages and to submit reports for HSPM directives.

Subcons will be able to build the BOM for a Microchip package and submit the information to Microchip for review and approval.

Subcons will be able to submit reports for HSPM directive the BOM for a Microchip package and submit the reports to Microchip for review and approval.

Accessing this application is a two-step process:

1. Partners must register themselves with Microchip. After registration login to eServices to request access for this application. Microchip Document Control will process the request and grant access.
2. Once access granted, users can launch the application to view/submit/track BOM and Report submission.